Indium KATEK to Present Joint Process Development at SMTconnect – SMT 007

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Indium Corporation expert Andreas Karch, regional technical manager and technologist – advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m. at Nuremberg, Germany. 
In their German-language presentation, Solder Material for Mounting Thermally Critical Components, Karch and Sedlatschek, will share the results of a joint process development project designed to guarantee the prevention of hotspots under thermally critical components utilizing a standard reflow process.
To learn more about Indium Corporation’s suite of proven products, visit indium.com/auto or stop by its booth (#5-320) at the show.
Andreas Karch provides technical support on solder paste and preforms, fluxes, and thermal management materials to Indium Corporation’s customers in Germany, Austria, and Switzerland. Karch has more than 20 years of automotive industry experience in PCB and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch is an ECQA-certified integrated design engineer and holds a Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to its customers in Europe.
Ralf Sedlatschek is the head of technology and radiation protection officer for KATEK Grassau. He is a state-certified engineer with more than 30 years of industry experience. His professional experience includes measurement engineer and quality manager for toolmaking and aviation industries; he has held multiple technical leading positions with KATEK Grassau since joining the company in 2005.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here. 
Indium Corporation expert Andreas Karch, regional technical manager and technologist – advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m. at Nuremberg, Germany. 
In their German-language presentation, Solder Material for Mounting Thermally Critical Components, Karch and Sedlatschek, will share the results of a joint process development project designed to guarantee the prevention of hotspots under thermally critical components utilizing a standard reflow process.
To learn more about Indium Corporation’s suite of proven products, visit indium.com/auto or stop by its booth (#5-320) at the show.
Andreas Karch provides technical support on solder paste and preforms, fluxes, and thermal management materials to Indium Corporation’s customers in Germany, Austria, and Switzerland. Karch has more than 20 years of automotive industry experience in PCB and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch is an ECQA-certified integrated design engineer and holds a Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to its customers in Europe.
Ralf Sedlatschek is the head of technology and radiation protection officer for KATEK Grassau. He is a state-certified engineer with more than 30 years of industry experience. His professional experience includes measurement engineer and quality manager for toolmaking and aviation industries; he has held multiple technical leading positions with KATEK Grassau since joining the company in 2005.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here. 
White Paper: With the move from low-mix to high mix-manufacturing, the need for optimizing throughput across multiple batches of different product is critical to maximizing manufacturing output. Overall line utilization… View White Paper
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